JPH0727631Y2 - 半導体パッケージ構造体 - Google Patents
半導体パッケージ構造体Info
- Publication number
- JPH0727631Y2 JPH0727631Y2 JP1989059574U JP5957489U JPH0727631Y2 JP H0727631 Y2 JPH0727631 Y2 JP H0727631Y2 JP 1989059574 U JP1989059574 U JP 1989059574U JP 5957489 U JP5957489 U JP 5957489U JP H0727631 Y2 JPH0727631 Y2 JP H0727631Y2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- semiconductor package
- frame body
- package structure
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title description 27
- 239000000758 substrate Substances 0.000 claims description 28
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 238000000465 moulding Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000002411 adverse Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Packaging Frangible Articles (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989059574U JPH0727631Y2 (ja) | 1989-05-23 | 1989-05-23 | 半導体パッケージ構造体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989059574U JPH0727631Y2 (ja) | 1989-05-23 | 1989-05-23 | 半導体パッケージ構造体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH031440U JPH031440U (en]) | 1991-01-09 |
| JPH0727631Y2 true JPH0727631Y2 (ja) | 1995-06-21 |
Family
ID=31586188
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989059574U Expired - Lifetime JPH0727631Y2 (ja) | 1989-05-23 | 1989-05-23 | 半導体パッケージ構造体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0727631Y2 (en]) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS628672U (en]) * | 1985-07-02 | 1987-01-19 | ||
| JPH079951B2 (ja) * | 1986-12-04 | 1995-02-01 | 沖電気工業株式会社 | 半導体装置の製造方法 |
-
1989
- 1989-05-23 JP JP1989059574U patent/JPH0727631Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH031440U (en]) | 1991-01-09 |
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